[Libre-soc-bugs] [Bug 508] decide package size and pin allocation for 180nm ASIC

[bugzilla-daemon at libre-soc.org]

https://bugs.libre-soc.org/show_bug.cgi?id=508

Jacob Lifshay <programmerjake at gmail.com> changed:

           What    |Removed                     |Added
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                 CC|                            |programmerjake at gmail.com

--- Comment #6 from Jacob Lifshay <programmerjake at gmail.com> ---
I didn't check which packages have what, but I think we should get a package
with a metal bottom since our test chip could use a few watts at 300MHz and be
harder to cool in just a plastic package. I'm assuming the cost of the packages
is small enough to be negligible.

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